Title :
Metallurgical reaction in soldered thick films
Author :
Chiou, Bi-Shiou ; Liu, K.C. ; Duh, Jenq-Gong
Author_Institution :
Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
Summary form only given, as follows. Pb/Sn solder and Pd/Ag thick-film conductor joints are formed by dipping and reflowing. The microstructure of the joints is investigated with emphasis on the metallurgical reaction between the solder and the thick-film materials. The morphology of the fracture surface in the conductor-solder interface after tensile test is evaluated by means of an electron microscope. The nature of the metallurgical reaction at the joint interface, the elemental redistribution around the fracture surface, and the formation of the intermetallic compound after aging and/or thermal cycling test are discussed
Keywords :
lead alloys; palladium alloys; reliability; silver alloys; soldering; thick film circuits; tin alloys; PbSn-PdAg; aging; conductor-solder interface; dip soldering; elemental redistribution; fracture surface; intermetallic compound; joint interface; metallurgical reaction; microstructure; morphology; reflow soldering; soldered thick films; tensile test; thermal cycling test; Conducting materials; Electrons; Inorganic materials; Joining materials; Microstructure; Surface cracks; Surface morphology; Testing; Thick films; Tin;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
DOI :
10.1109/IEMTS.1989.76173
