DocumentCode :
2766544
Title :
PDMS through-hole fabrication by soft lithography using CH4/He atmospheric RF plasma surface treatment
Author :
Choi, Jongchan ; Lee, Kyeong-Hwan ; Choi, Ji A. ; Lee, Sun Hwa ; Yang, Sung
Author_Institution :
Sch. of Inf. & Mechatron., Gwangju Inst. of Sci. Technol. (GIST), Gwangju, South Korea
fYear :
2011
fDate :
23-27 Jan. 2011
Firstpage :
304
Lastpage :
307
Abstract :
This paper presents a PDMS micro through-hole molding method by simple soft lithography process in which the surface of a master mold and a substrate is treated by atmospheric CH4/He RF plasma to feature hydrophobic property on the surface. Rectangular and circular-shaped PDMS micro through-hole layers are made by the proposed fabrication method. As one of the applications of the PDMS micro through-hole layer for multi-layered systems, a radial concentration gradient generator including a micro through-hole layer is constructed and its performance is tested. The micro through-holes fabricated by the proposed method are well-defined. The concentration gradients measured in radial directions are in a similar level. Also, the tearing problem, which is often happened in spin-coating and lift-off molding methods, is not observed during the fabrication process of the PDMS micro through-holes. Therefore, we believe that the proposed fabrication method contributes to improve the technology for PDMS through-hole fabrication.
Keywords :
carbon compounds; helium; lithography; plasma applications; surface treatment; CH4-He; PDMS micro through-hole fabrication molding method; RF plasma surface treatment; hydrophobic property; lift-off molding method; multilayered system; radial concentration gradient generator; soft lithography process; spin-coating method; Fabrication; Generators; Helium; Plasmas; Radio frequency; Substrates; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location :
Cancun
ISSN :
1084-6999
Print_ISBN :
978-1-4244-9632-7
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2011.5734422
Filename :
5734422
Link To Document :
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