DocumentCode
27672
Title
Method of Effective Roughness Dielectric in a PCB: Measurement and Full-Wave Simulation Verification
Author
Koledintseva, Marina Y. ; Vincent, Tracey ; Scogna, Antonio Ciccomancini ; Hinaga, Scott
Author_Institution
Dept. of Electr. & Comput. Eng., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Volume
57
Issue
4
fYear
2015
fDate
Aug. 2015
Firstpage
807
Lastpage
814
Abstract
Surface roughness topography of printed circuit boards (PCBs) needs to be included in signal integrity simulations in order to accurately predict the insertion loss of the structure and its delay time. An effective roughness dielectric (ERD) model can be used to substitute an inhomogeneous interface between copper foil and laminate dielectric in a PCB. Herein, this approach is tested for verification using 3-D full-wave numerical simulations. These ERD layers with the appropriate complex permittivity are included in the modeling of stripline examples. The parameters of an ambient laminate dielectric refined from conductor roughness in the stripline are determined using differential extrapolation roughness measurement technique. The agreement of the results of 3-D full-wave modeling simulations and measurements on multiple test structures justifies the proposed approach. Based on the extracted ERD parameters “design curves” can be built and used in numerical simulations of PCB high-speed designs.
Keywords
extrapolation; printed circuits; surface topography measurement; ERD model; PCB; copper foil; differential extrapolation roughness measurement technique; effective roughness dielectric model; full-wave simulation verification; laminate dielectric; printed circuit boards; signal integrity simulations; stripline; surface roughness topography; Conductors; Dielectric measurement; Dielectrics; Laminates; Numerical models; Stripline; Vehicles; Dielectric measurements; numerical analysis; printed circuit fabrication; rough surfaces; stripline;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2015.2412113
Filename
7086038
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