Fabrication and characterization of 3D integrated 2 DOF Micromirror Arrays for excessive thermal loads

Author

Ataman, Ç ; Lani, S. ; Noell, W. ; Jutzi, F. ; Bayat, D. ; de Rooij, N.

Author_Institution

Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland

fYear

2011

fDate

23-27 Jan. 2011

Firstpage

684

Lastpage

687

Abstract

This paper reports a high fill-factor (>;90%), 2-dimensional analog micromirror array designed specifically for very high, optically induced thermal load applications. Each pixel can attain a mechanical DC rotation angle of ±4 degrees around any arbitrary axis with 170V excitation. The maximum temperature rise on the mirror surface with 7 KW/m² thermal load under 1 Pa ambient pressure is below 230°C. A detailed assessment of the fabrication process - including the poly-Si vertical electrodes, wafer level mirror bonding, and copper electroplating of structural layers-, and characterization methodology is presented with experimental results.

Keywords

bonding processes; electroplating; microfabrication; micromirrors; silicon; 2D analog micromirror array; 3D integrated 2 DOF micromirror array; Si; copper electroplating; fabrication process; optically induced thermal load application; poly-silicon vertical electrode; voltage 170 V; wafer level mirror bonding; Actuators; Electrodes; Micromirrors; Silicon; Springs; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on

Conference_Location

Cancun

ISSN

1084-6999

Print_ISBN

978-1-4244-9632-7

Type

conf

DOI

10.1109/MEMSYS.2011.5734517

Filename

5734517