• DocumentCode
    2769451
  • Title

    SAW duplexer metallizations for high power durability

  • Author

    Satoh, Y. ; Nishihara, T. ; Ikata, O. ; Ueda, M. ; Ohomori, H.

  • Author_Institution
    Fujitsu Labs. Ltd., Akashi, Japan
  • Volume
    1
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    17
  • Abstract
    The improvement on power durability of SAW filters in order to realize a SAW duplexer is described in this study on IDT metallization. Compared with the conventional single layer metallizations such as Al-Cu, the laminated films are found to show the higher power durability. Many kinds of laminated film were tested changing the material of the middle layer for three layered films of which the top and bottom layers were made of Al-Cu or pure Al. Among them, two types of films such as Al-Cu/Cu/Al-Cu and Al/Mg/Al showed the best power durability. Al-Cu/Cu/Al-Cu had a lifetime 250 times longer than that of current Al-Cu single film. Al/Mg/Al further had a longer lifetime than Al-Cu/Cu/Al-Cu. These three layered films are being successfully applied to SAW antenna duplexers of cellular phones, indicating sufficient power durability for practical use
  • Keywords
    aluminium; aluminium alloys; antenna accessories; cellular radio; copper; interdigital transducers; magnesium; metallisation; surface acoustic wave filters; surface acoustic wave transducers; Al-Mg-Al; AlCu-Cu-AlCu; IDT metallization; SAW duplexer metallizations; SAW filters; cellular phones; lifetime; power durability; Aluminum alloys; Artificial intelligence; Biological materials; Cellular phones; Crystalline materials; Grain boundaries; Metallization; SAW filters; Surface acoustic wave devices; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1998. Proceedings., 1998 IEEE
  • Conference_Location
    Sendai
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-4095-7
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1998.762093
  • Filename
    762093