DocumentCode :
2774077
Title :
Optimization Of Mold Process Parameters And Tooling Variables For Highest Quality Plastic Packaging
Author :
Wittmershaus, Janice ; Kar, Rudra ; Verwoerd, Wouter
Author_Institution :
INTEL Corporation
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
30
Lastpage :
33
Keywords :
Delamination; Design for experiments; Design optimization; Lead; Leg; Passive optical networks; Plastic packaging; Shape control; Temperature control; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639857
Filename :
639857
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2774077
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