Title :
Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)
Abstract :
Presents the front cover of the proceedings.
Keywords :
cooling; integrated circuit packaging; semiconductor device packaging; thermal management (packaging); thermal variables measurement; advanced packaging; aircooled electronics; compact thermal models; thermal management materials; thermal measurement methods;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-5264-5
DOI :
10.1109/STHERM.1999.762419
