DocumentCode :
2774257
Title :
Thermal parameter estimation in the presence of uncertainty [packaging]
Author :
Emery, A.F.
Author_Institution :
Washington Univ., Seattle, WA, USA
fYear :
1999
fDate :
9-11 March 1999
Firstpage :
30
Lastpage :
33
Abstract :
Thermal properties are inferred from experiments by inverse techniques. In contrast to most mechanical and electrical experiments, thermal experiments usually involve boundary conditions and properties that have a degree of uncertainty. This uncertainty complicates the analysis and may lead to increased errors of estimation. This paper describes the application of an extended maximum likelihood principle to better quantify the amount of information yielded by the experiment and to reduce the effect of the uncertainty. The method is applied to an example of determining the contact resistance between a die and a substrate to demonstrate its use.
Keywords :
maximum likelihood estimation; thermal analysis; thermal management (packaging); thermal resistance; boundary conditions; contact resistance; die-substrate thermal contact resistance; estimation errors; estimation uncertainty; experimental information quantification; extended maximum likelihood principle; inverse techniques; packaging; thermal parameter estimation; thermal properties; Covariance matrix; Heat transfer; Noise measurement; Parameter estimation; Sensor systems; Temperature measurement; Temperature sensors; Thermal conductivity; Time measurement; Uncertainty;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location :
San Diego, CA, USA
ISSN :
1065-2221
Print_ISBN :
0-7803-5264-5
Type :
conf
DOI :
10.1109/STHERM.1999.762425
Filename :
762425
Link To Document :
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