Title :
Coating Carbon Nanotubes with Silver Nanoparticles to Get Conductive Nanocomposites
Author :
Peng Cheng Ma ; Kim, Jang-Kyo ; Ben Zhong Tang
Author_Institution :
Hong Kong Univ. of Sci. & Technol., Kowloon
Abstract :
A simple approach for coating carbon nanotubes (CNTs) with silver nanoparticles was developed in this work, aiming to enhance the electrical conductivity of CNTs. To coat Ag nanoparticles on CNTs (Ag@CNTs) effectively, CNTs were treated using ball milling with addition of ammonium bicarbonate, followed by reduction of silver ions in N,N- dimethylformamide (DMF). Transmission electron microscope (TEM), X-ray diffraction (XRD) and thermogravimetric analysis (TGA) were employed to characterize the changes of CNT surface and loading of Ag on CNTs, respectively. Then the Ag@CNTs were employed as conductive fillers in epoxy resin to get conductive nanocomposites. The electrical and mechanical properties of the nanocomposites were investigated and compared with those containing pristine CNTs (P-CNTs). It was found that the electrical conductivity of nanocomposites containing Ag@CNTs was significantly higher than those containing P- CNTs, confirming the advantage of the Ag@CNTs as effective conductive filler. The mechanical properties were similar between those nanocomposites containing Ag@CNTs and P-CNTs. The implications of the findings on electrical and mechanical properties were discussed regarding perspective applications of this conductive filler in electrical packaging industry.
Keywords :
X-ray diffraction; ball milling; carbon nanotubes; nanocomposites; nanoparticles; thermal analysis; transmission electron microscopy; TEM; TGA; X-ray diffraction; XRD; ball milling; carbon nanotubes coating; conductive filler; conductive nanocomposites; dimethylformamide; electrical conductivity; electrical packaging industry; mechanical properties; silver nanoparticles; thermogravimetric analysis; transmission electron microscope; Ball milling; Carbon nanotubes; Coatings; Conductivity; Mechanical factors; Nanocomposites; Nanoparticles; Silver; Transmission electron microscopy; X-ray diffraction;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430578