مرکز منطقه ای اطلاع رساني علوم و فناوري - The Effect Of Sputter Deposition Parameters On Selected Properties Of Titanium-tungsten (TiW) Thin Films

DocumentCode :

2777635

Title :

The Effect Of Sputter Deposition Parameters On Selected Properties Of Titanium-tungsten (TiW) Thin Films

Author :

Winter, C.M.

Author_Institution :

Advanced Micro Devices

fYear :

1992

fDate :

28-30 Sep 1992

Firstpage :

124

Lastpage :

128

Keywords :

Conductivity; Fuses; Semiconductor films; Sputtering; Substrates; Temperature; Thermal stresses; Thin film devices; Titanium; Tungsten;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International

Print_ISBN :

0-7803-0755-0

Type :

conf

DOI :

10.1109/IEMT.1992.639875

Filename :

639875

Link To Document :