• DocumentCode
    2777967
  • Title

    Tin Whisker Accelerated Test Project

  • Author

    Lee, Chieh-Ju ; Reynolds, Heidi

  • Author_Institution
    Cisco Syst. Inc., San Jose
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    21
  • Abstract
    A collection of slides from the authors conference presentation is given.
  • Keywords
    electroplating; life testing; tin; whiskers (crystal); accelerated test project; tin plating; tin whisker; Guidelines; Humidity; Life estimation; Production; Standards publication; Telephony; Testing; Thermal stresses; Tin; Zinc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430656
  • Filename
    4430656
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2777967