• DocumentCode
    2777977
  • Title

    Mapping Package Power Distribution Network Behavior into Electrical Parameters

  • Author

    Shi, Hong ; Yew, Yeehuan ; Jiang, Xiaohong

  • Author_Institution
    Altera Corp., San Jose
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper describes a systematic approach to map "black box" s-parameter behavior model into electrically meaningful RLC parameters based on physical layout and impedance transfer function theory. The s-parameter models are from either field solvers or from lab bench VNA measurement".
  • Keywords
    electric impedance; electronics packaging; power electronics; transfer functions; RLC parameter; black box s-parameter behavior model; electrical parameter; impedance transfer function theory; package power distribution network behavior; Capacitors; Circuit topology; Equivalent circuits; Frequency; Impedance; Packaging; Poles and zeros; Power system modeling; Power systems; Scattering parameters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430657
  • Filename
    4430657
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2777977