Title :
Future interconnect requirements in high-speed switches for Internet backbones
Author :
Luijten, Ronald P.
Author_Institution :
IBM Res. Div., Ruschlikon, Switzerland
Abstract :
Future packaging needs are projected from the perspective of a packet switch chip family. With the growth of bandwidth in the Internet, traditional copper-based intrabox transmission systems are running into limitations. Optics offer a solution, but the main challenge is to reduce the cost and establish appropriate standards
Keywords :
Internet; integrated circuit interconnections; integrated circuit packaging; integrated optoelectronics; optical interconnections; packet switching; technological forecasting; Internet backbones; Internet bandwidth; copper-based intrabox transmission systems; cost reduction; high-speed switches; interconnect requirements; optics-based interconnects; packaging; packet switch; packet switch chips; standards; Bandwidth; Communication switching; Integrated circuit interconnections; Internet; Optical packet switching; Packaging; Packet switching; Pins; Power dissipation; Switches;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895480
