Laser-induced chemical liquid phase deposition method for precipitation of Au-Cu alloy

Summary form only given. Since the very beginning the laser-assisted methods have become of critical importance for the metal deposition. Various laser techniques allow metal precipitation on the different kinds of the materials. One of them is the Laser-induced chemical liquid phase deposition (LCLD), which is considered among the others to be the most promising and efficient. Indeed, the LCLD method offers convenient way of the metal precipitation with rather high uniformity of the morphology and good electrical properties of the deposits. In spite of the achieved high quality of the metal structures the ongoing attempts are undertaken for the improving of the deposition efficiency and the quality. In the LCLD method the laser initiates the chemical reducing reaction and the laser focal volume determines the volume of this reaction what results in the localized submicron metal deposition. Also this method permits controlling width, morphology and resistance of metal structure as a result of variation laser power, temperature of solution and other parameters of deposition. The laser-assisted photothermal chemical reaction yields deposition of the structures on the substrate with high degree of adhesion. This method is characterized by technological efficiency, chemical safety and low-price equipment. Up to now the LCLD method was successfully realized for precipitation of such metals as Cu, Ni, Pd, Ag on several kinds of semiconductors and insulators such as Si, Ge, GaAs, polymers and so on. But a question about alloys deposition using this method has been never risen. In the present work the possibility of alloy precipitation was investigated. The deposition process was carried out from metalloorganic complexes witch consist of the [Au₆Cu₆] clusters ´wrapped´ in the [Au₃(diphosphine)₃]³⁺ triangles. Possibility to change Au-Cu ratio in the initial solution allow controling composition of the deposited metal s- tructure. This metallization technology can be successfully used in the microelectronics industry for the creation of the electrodes the metal conductors on the microchips, in the display technologies for the production on flexible polymer monitors and keyboards, creation micro thermocouples and so on. Creation of different combinations consisted of several kinds of metals (alloys) will open new application field of this technique in microelectronics industry and for creation metamaterials.