A new formula for effective dielectric constant in multi-dielectric layer microstrip structure

Author

Yoon, Yeong J. ; Kim, Bruce

Author_Institution

SyChip, Warren, NJ, USA

fYear

2000

fDate

2000

Firstpage

163

Lastpage

167

Abstract

A simple expression of effective dielectric constant for a microstrip on a multi-layered substrate is derived with the quasi-TEM assumption and the superposition of partial capacitance. Our method for a single-layer substrate provides a difference of within 2.32% compared to full-wave simulation. For the double layer case, our results are less than 2.2% different with an enhanced spectral domain technique and 1.6% with a variation method

Keywords

capacitance; circuit simulation; dielectric thin films; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; microstrip lines; microwave integrated circuits; permittivity; double layer case; effective dielectric constant; enhanced spectral domain technique; full-wave simulation; microstrip; multi-dielectric layer microstrip structure; multi-layered substrate; partial capacitance superposition; quasi-TEM assumption; single-layer substrate; variation method; Capacitance; Circuit simulation; Conductors; Dielectric constant; Dielectric materials; Dielectric substrates; Impedance; Integrated circuit interconnections; Microstrip components; Polyimides;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895519

Filename

895519