Title :
Analysis of high temperature superconductors for electronic interconnection applications
Author_Institution :
AT&T Bell Lab., Murray Hill, NJ, USA
Abstract :
An examination is made of the performance tradeoffs between conventional and superconducting interconnections in applications ranging from printed wiring boards to chips. For most semiconductor-device-based applications, the potential gains in wiring density offered by superconductors are probably more important than the bandwidth improvements. The analysis determines the values of critical current density above which superconductors outperform conventional wires in systems of various physical sizes. The particular interconnection technologies for which high-temperature superconductors show the most promise are thus identified
Keywords :
critical current density (superconductivity); high-temperature superconductors; integrated circuit technology; packaging; printed circuit accessories; superconducting junction devices; bandwidth; chips; critical current density; electronic interconnection; high temperature superconductors; performance tradeoffs; printed wiring boards; wiring density; Bandwidth; Conducting materials; High temperature superconductors; Integrated circuit interconnections; Semiconductor devices; Semiconductor materials; Superconducting filaments and wires; Superconducting materials; Superconductivity; Wiring;
Conference_Titel :
VLSI Technology, Systems and Applications, 1989. Proceedings of Technical Papers. 1989 International Symposium on
Conference_Location :
Taipei
DOI :
10.1109/VTSA.1989.68651
