Title :
Detailed electrical analysis of a benchmark MCM structure
Author :
Rubin, Barry J. ; Becker, Wiren Dale
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
A representative section of an MCM was analyzed using both full-wave analysis and a combined approach employing 2D and 3D field solvers and circuit simulation. Agreement of voltages on the active net was within a few percent and within about 15% for the major peaks on the quiet nets. Insight was gained by peeling away various sections of the structure and reanalyzing at each stage
Keywords :
circuit simulation; electromagnetic field theory; integrated circuit modelling; integrated circuit packaging; multichip modules; 2D field solvers; 3D field solvers; MCM; active net voltages; benchmark MCM structure; circuit simulation; electrical analysis; full-wave analysis; quiet net voltage peaks; representative MCM section; Circuit simulation; Conductors; Coupling circuits; Performance analysis; Power supplies; Shape; Surface impedance; Surface resistance; Termination of employment; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895534
