Title :
Frequency dependent RLC crosstalk evaluation of a high performance S/390 microprocessor chip
Author :
Smith, H. ; Deutsch, A. ; Mehrotra, S. ; Widiger, D. ; Bowen, M. ; Dansky, A. ; Kopcsay, G. ; Krauter, B.
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
A coupling noise evaluation of a high performance S/390 microprocessor using a full chip RLC extraction and simulation process is presented. Review of on-chip wiring guidelines with respect to the inaccuracies of an RC coupling evaluation for known net topologies is discussed in terms of tool requirements for full-chip noise evaluation which include inductive coupling effects. The extraction and simulation approach is described in terms of algorithms and procedures used to account for the frequency dependent RLC effects in a manner that allow a full chip noise evaluation. Results are presented which compare noise amplitude differences between RC and R(f)L(f)C evaluations for the wiring data of a S/390 microprocessor as well as pertinent statistics such as run times and memory usage
Keywords :
circuit simulation; crosstalk; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; microprocessor chips; network topology; software tools; RC coupling evaluation; S/390 microprocessor chip; algorithms; coupling noise; frequency dependent RLC crosstalk evaluation; frequency dependent RLC effects; full chip RLC noise extraction/simulation process; full chip noise evaluation; full-chip noise evaluation; inductive coupling effects; memory usage; net topologies; noise amplitude differences; on-chip wiring guidelines; run times; simulation; tool requirements; wiring data; Circuit noise; Coupling circuits; Crosstalk; Frequency dependence; Integrated circuit interconnections; Microprocessor chips; Noise level; RLC circuits; Wire; Wiring;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895554