DocumentCode :
2781141
Title :
Screening ICs On The Bare Chip Level: Temporary Packaging
Author :
Chu, D. ; Reber, C.A. ; Palmer, D.W.
Author_Institution :
Sandia National Laboratories
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
223
Lastpage :
226
Keywords :
Assembly; Bonding; Electronics packaging; Integrated circuit packaging; Integrated circuit testing; Microassembly; Multichip modules; Packaging machines; Protection; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639895
Filename :
639895
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2781141
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