DocumentCode :
278262
Title :
Implications for interconnect
Author :
Topham, David
Author_Institution :
Cambridge Interconnection Technol. Ltd., Kelso, UK
fYear :
1991
fDate :
33346
Firstpage :
42370
Lastpage :
42375
Abstract :
With non-UK manufactured semiconductors at the heart of electronics the way forward for the UK electronics industry now lies with using advanced semiconductors and other components rather than making them. And being successful will rest with adopting an agile approach to Interconnect Technology-every aspect of connecting components together to create electronic systems. Whilst the technical demands of new components and the expectations of a world-scale market are beyond our control these both present critical Implications for Interconnect; and there is now an urgent need to examine and understand them. In particular fineline chip-to-chip interconnect is discussed
Keywords :
VLSI; electronics industry; hybrid integrated circuits; printed circuit design; Implications for Interconnect; Interconnect Technology; UK electronics industry; connecting components; fineline chip-to-chip interconnect; world-scale market;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Advances in Interconnection Technology, IEE Colloquium on
Conference_Location :
London
Type :
conf
Filename :
181459
Link To Document :
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