• DocumentCode
    278262
  • Title

    Implications for interconnect

  • Author

    Topham, David

  • Author_Institution
    Cambridge Interconnection Technol. Ltd., Kelso, UK
  • fYear
    1991
  • fDate
    33346
  • Firstpage
    42370
  • Lastpage
    42375
  • Abstract
    With non-UK manufactured semiconductors at the heart of electronics the way forward for the UK electronics industry now lies with using advanced semiconductors and other components rather than making them. And being successful will rest with adopting an agile approach to Interconnect Technology-every aspect of connecting components together to create electronic systems. Whilst the technical demands of new components and the expectations of a world-scale market are beyond our control these both present critical Implications for Interconnect; and there is now an urgent need to examine and understand them. In particular fineline chip-to-chip interconnect is discussed
  • Keywords
    VLSI; electronics industry; hybrid integrated circuits; printed circuit design; Implications for Interconnect; Interconnect Technology; UK electronics industry; connecting components; fineline chip-to-chip interconnect; world-scale market;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Advances in Interconnection Technology, IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • Filename
    181459