DocumentCode
278262
Title
Implications for interconnect
Author
Topham, David
Author_Institution
Cambridge Interconnection Technol. Ltd., Kelso, UK
fYear
1991
fDate
33346
Firstpage
42370
Lastpage
42375
Abstract
With non-UK manufactured semiconductors at the heart of electronics the way forward for the UK electronics industry now lies with using advanced semiconductors and other components rather than making them. And being successful will rest with adopting an agile approach to Interconnect Technology-every aspect of connecting components together to create electronic systems. Whilst the technical demands of new components and the expectations of a world-scale market are beyond our control these both present critical Implications for Interconnect; and there is now an urgent need to examine and understand them. In particular fineline chip-to-chip interconnect is discussed
Keywords
VLSI; electronics industry; hybrid integrated circuits; printed circuit design; Implications for Interconnect; Interconnect Technology; UK electronics industry; connecting components; fineline chip-to-chip interconnect; world-scale market;
fLanguage
English
Publisher
iet
Conference_Titel
Advances in Interconnection Technology, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
181459
Link To Document