DocumentCode :
2782690
Title :
A Study on Wire Ball/Pad Open Failure Mechanism of a Multi-Stack Package (MSP) under High Temperature Storage (HTS) Condition
Author :
Yang, Se Young ; Byun, Hyeong-Jik ; Park, Sang-Wook ; Lee, Wang-Joo
Author_Institution :
Samsung Electron. Co. Ltd, Gyeonggi
fYear :
2007
fDate :
15-19 April 2007
Firstpage :
113
Lastpage :
116
Abstract :
The mechanism of a wire ball/pad open failure at a gold wire and bonding pad interface of a multi-stack package (MSP) under high temperature storage (HTS) condition, 150 degC, is studied. Failure analysis using FE-SEM (field emission) and FIB-SEM (focused ion beam) was conducted. The analysis revealed that the main factors that contribute to a ball/pad failure were the tensile (pull-off) stress imposed on the gold wire and the bond weakening process due to metallic diffusion and corrosion. By preparing altered MSP samples and conducting verification HTS tests, it was found that the tensile stress was due to the thermal expansion of the protective encapsulant applied at the wirebonding region. Further failure analysis using FIB-SEM, AES, and TOF-SIMS indicated that the bonding strength between the gold wire and pad degraded due to the Kirkendall void resulting from metallic diffusion at high temperature and the IMC corrosion due to ion impurity
Keywords :
corrosion; encapsulation; failure analysis; focused ion beam technology; lead bonding; tensile testing; 150 C; FE-SEM; FIB-SEM; Kirkendall void; ball/pad failure; bond weakening process; bonding pad interface; bonding strength; failure analysis; field emission; focused ion beam; gold wire; high temperature storage condition; ion impurity; metallic corrosion; metallic diffusion; multistack package; protective encapsulant; tensile stress; thermal expansion; wire ball/pad open failure mechanism; wirebonding region; Corrosion; Diffusion bonding; Failure analysis; Gold; High temperature superconductors; Ion beams; Packaging; Tensile stress; Thermal stresses; Wire; Kirkendall void; corrosion; failure mechanism; high temperature storage (HTS); multi-stack package (MSP); tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location :
Phoenix, AZ
Print_ISBN :
1-4244-0919-5
Electronic_ISBN :
1-4244-0919-5
Type :
conf
DOI :
10.1109/RELPHY.2007.369878
Filename :
4227619
Link To Document :
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