DocumentCode

2783166

Title

Mechanical properties of soft solder materials for electronic applications

Author

Beuers, J. ; Pteschek, G. ; Schlamp, G.

Author_Institution

Demetron GmbH

fYear

1992

fDate

1992

Firstpage

120

Lastpage

130

Keywords

Electronic components; Heat sinks; Intermetallic; Lead; Materials reliability; Mechanical factors; Metallization; Soldering; Stability; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International

Print_ISBN

0-7803-0629-5

Type

conf

DOI

10.1109/IEMT.1992.763402

Filename

763402