DocumentCode
2798263
Title
On-chip matching Si-MMIC for mobile communication terminal application
Author
Suematsu, N.
Author_Institution
Inf. Technol. R&D Center, Mitsubishi Electr. Corp., Kanagawa, Japan
fYear
1997
fDate
10-10 June 1997
Firstpage
9
Lastpage
12
Abstract
Recent developments of BiCMOS Si-MMICs for wireless communication applications are reviewed. Among these MMIC´s, on-chip matching Si-MMICs are suitable for use in compact transceivers. The use of coplanar waveguide (CPW) type spiral inductors is one of the solutions to achieve low loss matching circuits on a low resistive Si substrate used in standard BiCMOS process. An on-chip matching Si-MMIC front-end has been fabricated, in which CPW type spiral inductors are employed. The measured performance at 1.9 GHz with low d.c. power consumption shows the possibility of application to mobile handset terminals. In addition, the feasibility to implement the system on-chip concept is discussed by referring to an IF/PLL IC fabricated in the same process.
Keywords
BiCMOS integrated circuits; UHF integrated circuits; coplanar waveguides; elemental semiconductors; impedance matching; inductors; mobile communication; phase locked loops; silicon; transceivers; 1.9 GHz; BiCMOS; DC power consumption; IF/PLL IC; MMIC; Si; compact transceivers; coplanar waveguide; handset terminals; mobile communication terminal; on-chip matching; spiral inductors; wireless communication applications; BiCMOS integrated circuits; Coplanar waveguides; Energy consumption; Inductors; Mobile communication; Mobile handsets; Power measurement; Spirals; Transceivers; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits (RFIC) Symposium, 1997., IEEE
Conference_Location
Denver, CO, USA
Print_ISBN
0-7803-4063-9
Type
conf
DOI
10.1109/RFIC.1997.598731
Filename
598731
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