DocumentCode
280210
Title
A CAD package for the prediction and reduction of radio-frequency interference from microprocessor based electronic equipment
Author
Marvin, A.C. ; Tealby, J.M. ; Carr-Brion, T.J.F. ; Porter, S.J. ; Mann, S.M.
Author_Institution
York Univ., UK
fYear
1990
fDate
33038
Firstpage
42614
Lastpage
42616
Abstract
The authors describe the production of an EMC CAD package for use in the design of electronic computing equipment. The design of electronic equipment is split up into several separate areas such as circuit design, circuit layout, enclosure design, and thermal design. EMC considerations are taken into account at all stages in the design process
Keywords
circuit layout CAD; electromagnetic compatibility; interference suppression; printed circuit design; EMC CAD package; PCB model; RFI prediction/reduction; circuit design; circuit layout; electronic computing equipment; enclosure design; microprocessor based electronic equipment; radio-frequency interference; thermal design;
fLanguage
English
Publisher
iet
Conference_Titel
Interference and Design for EMC in Microprocessor Based Systems, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
190407
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