Modelling of the two-phase cooling of a power semiconductor and its associated evaporators

Author

Jomard, T. ; Eckes, U. ; Touvier, E. ; Lallemand, M.

Author_Institution

GEC Alsthom, Villeurbanne, France

fYear

1992

fDate

3-5 Feb 1992

Firstpage

20

Lastpage

24

Abstract

Cooling by nucleate boiling is one of the most efficient ways of removing heat from a component. A theoretical study and a model have been developed to determine heat transfer in semiconductors. Heat is removed from the semiconductor via two evaporators joining the press-pack package. The two-phase flow is evaluated inside the channels formed by the evaporators and the semiconductor. The heat transfer modeling has led to a knowledge of the semiconductor temperature evolution versus the dissipated power. The optimization of the channel shape has permitted an increase in evaporator performance

Keywords

boiling; cooling; finite element analysis; packaging; power electronics; temperature distribution; two-phase flow; FEM; channel shape optimization; dissipated power; evaporators; heat transfer; model; nucleate boiling; power semiconductor; press-pack package; temperature evolution; two-phase cooling; two-phase flow; Dielectrics and electrical insulation; Electronics cooling; Equations; Heat transfer; Packaging; Power electronics; Power system modeling; Shape; Space heating; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE

Conference_Location

Austin, TX

Print_ISBN

0-7803-0500-0

Type

conf

DOI

10.1109/STHERM.1992.172848

Filename

172848