Abstract :
The 13th Topical Meeting on Electrical Performance of Electronic Packaging provides a forum for the presentation and discussion of the latest advances in the electrical design, analysis and characterization of on chip and off chip package interconnections and structures covering all the application families and frequency ranges namely, digital, RF, microwave and mm-wave applications. One of the key objectives of this meeting is to bring together researchers and practicing engineers from industry, universities, and govemment laboratories from around the world to address all current and future issues affecting the electrical performance of high speed electronic systems. The conference is organized into eleven sessions of oral presentations and one open forum (poster) session for one-to-one discussions. The meeting begins with a keynote speech entitled "Technological Challenges for the Digital Home" by Stephen L. Smith of Intel. The following ten sessions are dedicated to RF/Microwave Techniques, System Design and Technology, Power Distribution Design and Noise, Electromagnetic Issues, Transmission Lines, Measurements, On-chip Issues and Interconnection Macromodeling. Five short courses are being offered on the day prior to the start of the meeting. The tutorials are given by well-known experts in their fields and cover important topics such as measurements and modeling of high-speed interconnects, power distribution design and analysis methods, high-frequency measurement techniques for packaging characterization and I/O circuit design.
