Integration of a 140 GHz Packaged LTCC Grid Array Antenna With an InP Detector

Author

Bing Zhang ; Gulan, Heiko ; Zwick, Thomas ; Yinggang Li ; Oderfalt, Ulf ; Carlsson, Fredrik ; Zirath, Herbert

Author_Institution

Dept. of Microtechnol. & Nanosci., Chalmers Univ. of Technol., Gothenburg, Sweden

Volume

5

Issue

8

fYear

2015

fDate

Aug. 2015

Firstpage

1060

Lastpage

1068

Abstract

Integration of a 140-GHz packaged low-temperature cofired ceramic (LTCC) antenna with a power detector is demonstrated under the concept of antenna-in-package. The detector is designed on an indium phosphide (InP) process. A grid array antenna in LTCC is designed to provide package for the detector. Coplanar ground-signal-ground (GSG) bond wires are used to connect the detector and the antenna. Parallel plate mode is observed in the InP substrate and absorbed by the LTCC substrate. The comparison between the measured responsivity of the power detector with and without the antenna indicates the acceptable insertion loss of the coplanar GSG bond wires transition. It shows a feasible solution for the D-band front-end integration and packaging.

Keywords

antenna arrays; ceramic packaging; D-band front-end integration and packaging; LTCC grid array antenna; antenna-in-package concept; coplanar ground-signal-ground bond wires; frequency 140 GHz; indium phosphide process; packaged low-temperature cofired ceramic antenna; parallel plate mode; power detector; Antennas; Detectors; III-V semiconductor materials; Indium phosphide; MMICs; Substrates; Wires; Antenna-in-package (AiP); grid array antenna (GAA); low-temperature cofired ceramic (LTCC); parallel plate mode (PPM); parallel plate mode (PPM).;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2015.2453407

Filename

7173018