Accurate analysis of multi-layered signal and power distributions using the fringe RLGC models

This work introduces the fringe RLGC (i.e., resistance, inductance, conductance, and capacitance) models to accurately compute the broadband S parameters for not only large power planes but also thin signal traces in multi-layered package and PCB environments. With comparable accuracy and 100× faster than a 3D full-wave field solver, this technique enables ultra-fast design iterations to optimize the layouts for insertion and return losses, resonance frequencies, and placement of decoupling capacitors, etc.