Life Cycle Assessment of Recycling Copper Process from Copper-Slag

Author

Li Yingshun ; Guan Jie

Author_Institution

Inst. of Chem. & Environ. Eng., CUMTB, Beijing, China

Volume

1

fYear

2009

fDate

16-18 Oct. 2009

Firstpage

198

Lastpage

201

Abstract

The predigestion life cycle assessment (LCA) method has been applied to investigate the environmental impact of the recycle copper process from copper-slag. Related environmental load data of each process stage have been obtained. Copper-slag recycle copper process includes crushing, milling, flotation, dehydration. Environmental impact single data of each process stage is 0.0168, 0.0200, 0.0615, 0.0279, total environmental impact single data of copper-slag is 0.1262. Copper-ore recycle process includes mining, crushing, milling, flotation, dehydration. Environmental impact single data of each process stage is 0.1120, 0.0138, 0.0152, 0.0617, 0.0287, total environmental impact single data of copper-slag is 0.2314. Copper-slag recycle process has not mining process. The total impact single score of copper-slag process is 0.55 times than copper-ore. Recycle copper from slag will improve the utilization of resource, reduce environmental load and development of circulation economics.

Keywords

copper; environmental economics; life cycle costing; metallurgical industries; milling; product life cycle management; recycling; slag; Cu; circulation economics; copper ore recycle process; copper slag recycle process; crushing; dehydration; environmental impact; flotation; milling; predigestion life cycle assessment; Chemical technology; Copper; Energy consumption; ISO standards; Metals industry; Milling; Raw materials; Recycling; Slag; Smelting; Eco-indicator99; Simapro7.1; copper-ore; copper-slag; life cycle assessment (LCA); recycle copper process;

fLanguage

English

Publisher

ieee

Conference_Titel

Energy and Environment Technology, 2009. ICEET '09. International Conference on

Conference_Location

Guilin, Guangxi

Print_ISBN

978-0-7695-3819-8

Type

conf

DOI

10.1109/ICEET.2009.54

Filename

5362759