• DocumentCode
    2806911
  • Title

    Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams

  • Author

    Ho, Jeffrey C W ; Zhu, Quanyan ; Abhari, Ramesb

  • Author_Institution
    Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
  • fYear
    2004
  • fDate
    25-27 Oct. 2004
  • Firstpage
    195
  • Lastpage
    198
  • Abstract
    In this work, data transmission in transmission lines containing textured ground planes in the power distribution network is investigated. A lumped element model is developed to generate eye diagrams and circuit simulations are compared with measurements. A circuit model for a transmission line with an EBG ground plane is introduced. The circuit model for the EBG structure is developed based on using LC components and considering each patch as a parallel-plate transmission line. This modeling strategy allows including two important features to the individual LC stages representing the EBG surface: coupling to the signal line, and transverse loading of adjacent patches in the EBG structure. The circuit model parameters are calculated by using closed-form relations and applying the physical dimensions of the structure-under-test. The proposed model is employed to generate the scattering-parameter graphs and eye diagrams, which are compared with full-wave simulations and measurements to ensure validation of the results in both frequency and time domains.
  • Keywords
    circuit simulation; data communication; distribution networks; frequency-domain analysis; interference suppression; photonic band gap; time-domain analysis; transmission lines; LC components; circuit model parameters; circuit simulations; closed form relations; data transmission; electromagnetic band gap structure; eye diagrams; frequency domain analysis; full wave simulations; lumped element model; parallel plate transmission line; power distribution network; scattering parameter graphs; structure under test; textured ground planes; time domain analysis; transmission line modeling; Circuit simulation; Coupling circuits; Data communication; Distributed parameter circuits; Metamaterials; Periodic structures; Power systems; Power transmission lines; Transmission line measurements; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
  • Print_ISBN
    0-7803-8667-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2004.1407584
  • Filename
    1407584