DocumentCode :
2807158
Title :
Proceedings of technical papers
fYear :
2007
fDate :
1-3 Oct. 2007
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei, Taiwan
Print_ISBN :
978-1-4244-1637-0
Electronic_ISBN :
978-1-4244-1637-0
Type :
conf
DOI :
10.1109/IMPACT.2007.4433552
Filename :
4433552
Link To Document :
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