DocumentCode

2807173

Title

[Copyright notice]

fYear

2007

fDate

1-3 Oct. 2007

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International

Conference_Location

Taipei

Print_ISBN

978-1-4244-1636-3

Type

conf

DOI

10.1109/IMPACT.2007.4433553

Filename

4433553