DocumentCode :
2807326
Title :
The effect of an electric field on behaviour of thermally induced bubble in liquid nitrogen
Author :
Wang, P. ; Swaffield, D.J. ; Lewin, P.L. ; Chen, G.
Author_Institution :
Univ. of Southampton, Southampton
fYear :
2008
fDate :
June 30 2008-July 3 2008
Firstpage :
1
Lastpage :
4
Abstract :
The effect of a dc uniform electric field on the behaviour of bubbles in liquid nitrogen such as their growth, deformation and departure frequency has been experimentally investigated. The experiment was performed using a stainless steel mesh-plate electrode. The experimental results show that (1) prolate spherical bubbles are formed in the direction of electric field and bubble deformation increases with increasing applied voltage, (2) the bubble departure frequency decreases and the departure volume increases with increasing electric field strength, (3) any effect of the electric field polarity is not obvious. For clarifying these phenomena, the electric field distribution around a bubble has been simulated using the finite element analysis (FEA) method and the electric force acting on bubble calculated numerically. In addition, the effect of changes to thermal bubble behaviour on boiling heat transfer is also discussed. Obtained results may lay a foundation for exploring the mechanism of electrohydrodynamic (EHD) enhancement of boiling heat transfer of liquid nitrogen.
Keywords :
boiling; bubbles; cryostats; electric field effects; electrohydrodynamics; finite element analysis; DC uniform electric field; boiling heat transfer; bubble deformation; electric field effect; electric field polarity; electrohydrodynamic enhancement; finite element analysis method; liquid nitrogen; prolate spherical bubbles; stainless steel mesh-plate electrode; thermally induced bubble; Cameras; Electrodes; Electrohydrodynamics; Frequency; Heat transfer; Nitrogen; Resistance heating; Steel; Temperature control; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Dielectric Liquids, 2008. ICDL 2008. IEEE International Conference on
Conference_Location :
Futuroscope-Chasseneuil
Print_ISBN :
978-1-4244-1585-4
Electronic_ISBN :
978-1-4244-1586-1
Type :
conf
DOI :
10.1109/ICDL.2008.4622464
Filename :
4622464
Link To Document :
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