• DocumentCode
    2807928
  • Title

    A schematic-based design model for microphone and circuit integration

  • Author

    Chen, Jen-Yi ; Lee, Shu-Sheng ; Chang, Peter ; Chu, Chun-Hsun ; Mukherjee, Tamal ; Fedder, GaryK

  • Author_Institution
    Ind. Technol. Res. Inst., Taipei
  • fYear
    2007
  • fDate
    1-3 Oct. 2007
  • Firstpage
    157
  • Lastpage
    160
  • Abstract
    The transistor-level elements for condenser microphone design have been implemented in an IC design environment. Arbitrary diaphragm shapes can be composed and simulated by using our basic elements. The sensitivity and frequency response are obtained by co-simulation with the microphone and the readout circuit using Cadence/Spectrereg simulator. The new model is capable of dealing with the multi-field coupling effects including acoustical, mechanical and electrostatic behavior. Comparing to the ANSYS static simulation by using shell63 elements, our design model gives matched results based on the same mesh condition. Both the finite element analysis and theoretical calculated natural frequency agree with the nodal simulation results. Co-simulation enables trade-off analysis between the acousto-electro-mechanical and electronic design parameters. Furthermore, this platform provides a unified design interface between mechanical and electrical engineers, which is critical for top-down design of monolithic microsystems.
  • Keywords
    finite element analysis; integrated circuit design; microphones; ANSYS static simulation; Cadence-Spectre; IC design; acousto-electro-mechanical design parameters; arbitrary diaphragm shapes; condenser microphone; electronic design parameters; finite element analysis; frequency response; monolithic microsystems; multi-field coupling effects; readout circuit; shell63 elements; transistor-level elements; Acoustical engineering; Analytical models; Circuit simulation; Coupling circuits; Design engineering; Electrostatics; Finite element methods; Frequency response; Microphones; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-1636-3
  • Electronic_ISBN
    978-1-4244-1637-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2007.4433590
  • Filename
    4433590