• DocumentCode
    2807935
  • Title

    The breakdown characteristics of the liquefied SF6

  • Author

    Eun-Hyuck Choi ; Kim, Se-Dong ; Lim, Chang-Ho ; Choi, Sang-Tae ; Lee, Kwang-Sik

  • Author_Institution
    Dept. of Electr. Eng., Yeungnam Univ., Gyeongsan
  • fYear
    2008
  • fDate
    June 30 2008-July 3 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper the investigation of breakdown characteristics liquefied SF6 (LSF6) in model GIS (gas insulated switchgear) were described. The ability of LSF6 insulation is higher than high-pressurized SF6 gas. The breakdown characteristics of LSF6 were produced by bubble formed evaporation of LSF6 and bubble caused by high electric emission and corona. Also, The property of dielectric breakdown is determined by electrode form, electrode arrangement, bubble formation and movement, arc extinguishing capacity of media, difficulty in corona formation, and the distance between electrodes. The bubble formation and flow separation phenomenon were identified for LSF6. It is considered in this paper that the results are fundamental data for electric insulation design of a high-temperature superconductor and cryogenic equipments machinery which will be studied and developed in the future.
  • Keywords
    SF6 insulation; bubbles; corona; evaporation; flow separation; gas insulated switchgear; GIS; LSF6 insulation; SF6; SF6 gas; arc extinguishing capacity; breakdown characteristics; bubble formation; bubble formed evaporation; corona; cryogenic equipments; dielectric breakdown; electric emission; electric insulation design; electrode arrangement; electrode form; flow separation phenomenon; gas insulated switchgear; high-temperature superconductor; liquefied SF6; Corona; Cryogenics; Dielectric breakdown; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Gas insulation; Geographic Information Systems; High temperature superconductors; Switchgear;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dielectric Liquids, 2008. ICDL 2008. IEEE International Conference on
  • Conference_Location
    Futuroscope-Chasseneuil
  • Print_ISBN
    978-1-4244-1585-4
  • Electronic_ISBN
    978-1-4244-1586-1
  • Type

    conf

  • DOI
    10.1109/ICDL.2008.4622495
  • Filename
    4622495