DocumentCode :
2808280
Title :
Nanopackaging: Nanotechnologies and electronics packaging
Author :
Morris, James E.
Author_Institution :
Portland State Univ., Portland
fYear :
2007
fDate :
1-3 Oct. 2007
Firstpage :
251
Lastpage :
254
Abstract :
The importance of nanoelectronics and "electro- nanotechnologies" in the future is sufficiently well recognized to have become the subject of industrial and government policy roadmaps. Similarly, the academic world is responding with graduate level courses, (although with few textbooks so far.) As for electronics packaging, the field requires students to be "subject multilingual". Candidate next-generation nanoelectronics technologies, (e.g. single-electron transistors, quantum automata, molecular electronics, etc.,) are generally hyper-sensitive to dimensional change, if based on quantum-mechanical electron tunneling, and this is just one example of how appropriate packaging will be essential to the success or failure of these technologies. Packaging strategies must therefore be developed in parallel with the basic nanoelectronics device technologies in order to make informed decisions as to their commercial viabilities.
Keywords :
carbon nanotubes; electronics packaging; integrated circuit packaging; nanoelectronics; nanoparticles; carbon nanotubes; electro-nanotechnologies; electronics packaging; nano-interconnects; nanoelectronics; nanopackaging; nanoparticles; quantum-mechanical electron tunneling; Atmospheric modeling; Ceramics; Components, packaging, and manufacturing technology; Composite materials; Electronics packaging; Electrons; High-K gate dielectrics; Nanoparticles; Optical surface waves; Surface waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1636-3
Electronic_ISBN :
978-1-4244-1637-0
Type :
conf
DOI :
10.1109/IMPACT.2007.4433610
Filename :
4433610
Link To Document :
بازگشت