DocumentCode
2808280
Title
Nanopackaging: Nanotechnologies and electronics packaging
Author
Morris, James E.
Author_Institution
Portland State Univ., Portland
fYear
2007
fDate
1-3 Oct. 2007
Firstpage
251
Lastpage
254
Abstract
The importance of nanoelectronics and "electro- nanotechnologies" in the future is sufficiently well recognized to have become the subject of industrial and government policy roadmaps. Similarly, the academic world is responding with graduate level courses, (although with few textbooks so far.) As for electronics packaging, the field requires students to be "subject multilingual". Candidate next-generation nanoelectronics technologies, (e.g. single-electron transistors, quantum automata, molecular electronics, etc.,) are generally hyper-sensitive to dimensional change, if based on quantum-mechanical electron tunneling, and this is just one example of how appropriate packaging will be essential to the success or failure of these technologies. Packaging strategies must therefore be developed in parallel with the basic nanoelectronics device technologies in order to make informed decisions as to their commercial viabilities.
Keywords
carbon nanotubes; electronics packaging; integrated circuit packaging; nanoelectronics; nanoparticles; carbon nanotubes; electro-nanotechnologies; electronics packaging; nano-interconnects; nanoelectronics; nanopackaging; nanoparticles; quantum-mechanical electron tunneling; Atmospheric modeling; Ceramics; Components, packaging, and manufacturing technology; Composite materials; Electronics packaging; Electrons; High-K gate dielectrics; Nanoparticles; Optical surface waves; Surface waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location
Taipei
Print_ISBN
978-1-4244-1636-3
Electronic_ISBN
978-1-4244-1637-0
Type
conf
DOI
10.1109/IMPACT.2007.4433610
Filename
4433610
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