• DocumentCode
    2808302
  • Title

    Thick SU-8 and PDMS Three-Dimensional Enclosed Channels for Free-Standing Polymer Microfluidic Systems

  • Author

    Westwood, Stephanie M. ; Jaffer, Seema ; Lui, Olha A. ; Gray, Bonnie L.

  • Author_Institution
    Simon Fraser Univ., Burnaby
  • fYear
    2007
  • fDate
    22-26 April 2007
  • Firstpage
    12
  • Lastpage
    15
  • Abstract
    This paper presents the design, simulation, and fabrication of polymer 3D enclosed free-standing microchannels. These microchannels are designed to be combined with polymer interconnects for the eventual realization of modularly connected polymer microfluidic systems. Microchannels with a width of 200 mum, depth of 200 mum, and a channel length of 8400 mum were simulated using ANSYS CFD Flotran. Preliminary simulations with an input velocity of 0.02 m/s yielded an expected pressure drop along the microchannel of 52 Pa. PDMS and SU-8 microchannels were fabricated ranging in thicknesses from 200 mum to 300 mum, and a sacrificial process using thick photoresist (SC 1827) and structural SU-8 (SU-8 100) was developed for releasing the SU-8 enclosure layer. In addition, 200 mum to 300 mum thick SU-8 molds were employed for PDMS (Sylgard 184) processing. After bonding, the fabrication resulted in freestanding microchips in SU-8 or PDMS with enclosed microchannels that are compatible with microfluidic polymer interconnect.
  • Keywords
    computational fluid dynamics; interconnections; microfluidics; photoresists; polymers; ANSYS CFD Flotran; PDMS; SC 1827 photoresist; SU-8 100; Sylgard 184; depth 200 mum; free-standing polymer microfluidic systems; microfluidic polymer interconnect; polydimethylsiloxane; size 200 mum; size 8400 mum; three-dimensional enclosed channels; Analytical models; Fabrication; Hydraulic diameter; Instruments; Microchannel; Microfluidics; Optical materials; Polymers; Shape; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Computer Engineering, 2007. CCECE 2007. Canadian Conference on
  • Conference_Location
    Vancouver, BC
  • ISSN
    0840-7789
  • Print_ISBN
    1-4244-1020-7
  • Electronic_ISBN
    0840-7789
  • Type

    conf

  • DOI
    10.1109/CCECE.2007.10
  • Filename
    4232669