DocumentCode :
2808696
Title :
The develpoment and application of low Dk material
Author :
Liang, Peter
Author_Institution :
Nan Ya Plastic Corp., South Yarmouth
fYear :
2007
fDate :
1-3 Oct. 2007
Firstpage :
363
Lastpage :
368
Abstract :
The trends for electronics products are toward smaller size, lighter weights, higher speeds and higher frequency applications. Standard FR4 material faces an extreme limit for these applications, especially in regard to Dk, Df and reliability. Decreasing the Dk of the laminate will increase operating speeds of processing (i.e. Pentium processor, Rambus and future processor. The low Dk material can also provide a wider working window in the production process for narrow line PCB. Normal FR4 material can´t meet the requirement of high speed circuit design. In order to reduce Dk value from 4.6 to 3.8, Nan Ya try to develop new resin system and combine with low Dk glass cloth. Our goal is to develop low Dk with low cost material.
Keywords :
electronic products; glass; laminates; high speed circuit design; low Dk glass cloth; low Dk material; Absorption; Costs; Frequency; Glass; Laminates; Materials reliability; Moisture; Propagation losses; Resins; Telecommunication network reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1636-3
Electronic_ISBN :
978-1-4244-1637-0
Type :
conf
DOI :
10.1109/IMPACT.2007.4433637
Filename :
4433637
Link To Document :
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