• DocumentCode
    2808802
  • Title

    Micromachined capacitive transducer arrays for medical ultrasound imaging

  • Author

    Jin, X.C. ; Degertekin, F.L. ; Calmes, S. ; Zhang, X.J. ; Ladabaum, I. ; Khuri-Yakub, B.T.

  • Author_Institution
    Edward L. Ginzton Lab., Stanford Univ., CA, USA
  • Volume
    2
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    1877
  • Abstract
    The fabrication and characterization of micromachined capacitive ultrasonic transducers are discussed with emphasis on the array operation. Several micromachined capacitive transducer arrays have been fabricated using CMOS compatible micromachining technology. Pulse echo experiments show around 100% bandwidth and the potential for phased array imaging. Radiation pattern and cross-coupling measurements are performed on the 1-D and 2-D arrays. Cross-coupling mechanisms due to Lamb and Stoneley type waves are identified by experiments and verified by theoretical calculations. Deep trench etching between array elements and wafer thinning are proposed to reduce the effects of these spurious waves for certain applications. Initial results on array imaging with 64 element 1D micromachined capacitive transducer arrays are also presented
  • Keywords
    biomedical transducers; biomedical ultrasonics; capacitive sensors; etching; micromachining; ultrasonic transducer arrays; 1-D arrays; 2-D arrays; CMOS compatible micromachining; Lamb type waves; Stoneley type waves; array operation; cross-coupling mechanisms; crosstalk; deep trench etching; fabrication; medical ultrasound imaging; micromachined capacitive transducer arrays; phased array imaging; pulse echo experiments; radiation pattern; spurious waves; ultrasonic transducers; wafer thinning; Bandwidth; Biomedical imaging; Biomedical transducers; CMOS technology; Fabrication; Micromachining; Phased arrays; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1998. Proceedings., 1998 IEEE
  • Conference_Location
    Sendai
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-4095-7
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1998.765318
  • Filename
    765318