• DocumentCode
    2809239
  • Title

    Insulation properties of nano- and micro-filler mixture composite

  • Author

    Imai, Takahiro ; Sawa, Fumio ; Nakano, Toshiyuki ; Ozaki, Tamon ; Shimizu, Toshio ; Kuge, Shin-Ichi ; Kozako, Masahiro ; Tanaka, Toshikatsu

  • Author_Institution
    Power & Ind. Syst. R&D Center, Toshiba Corp., Yokohama, Japan
  • fYear
    2005
  • fDate
    16-19 Oct. 2005
  • Firstpage
    171
  • Lastpage
    174
  • Abstract
    This paper presents the electrical insulation properties of a newly-developed composite material comprising a nano- and micro-filler mixture. The filler mixture composite was made by dispersing layered silicate fillers and silica fillers in epoxy resin. The filler mixture composite had the same low thermal expansion as aluminum. Moreover, comparison with other composites demonstrated the effects of the filler mixture. The filler mixture composite showed excellent insulation breakdown properties in needle-plate electrode geometry. Microscope observation indicated a densely-packed structure of the filler mixture composite. The morphological feature seems to have an impact on the improvement of insulation breakdown properties.
  • Keywords
    electric breakdown; electric properties; electrodes; epoxy insulation; filled polymers; materials preparation; nanocomposites; thermal expansion; aluminum; densely-packed structure; dispersing layered silicate filler; electrical insulation property; epoxy resin; insulation breakdown; low thermal expansion; microfiller mixture composite; microscope observation; morphological feature; nanofiller mixture composite; needle-plate electrode geometry; Aluminum; Composite materials; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Epoxy resins; Nanocomposites; Nanostructured materials; Silicon compounds; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2005. CEIDP '05. 2005 Annual Report Conference on
  • Print_ISBN
    0-7803-9257-4
  • Type

    conf

  • DOI
    10.1109/CEIDP.2005.1560648
  • Filename
    1560648