DocumentCode
2809239
Title
Insulation properties of nano- and micro-filler mixture composite
Author
Imai, Takahiro ; Sawa, Fumio ; Nakano, Toshiyuki ; Ozaki, Tamon ; Shimizu, Toshio ; Kuge, Shin-Ichi ; Kozako, Masahiro ; Tanaka, Toshikatsu
Author_Institution
Power & Ind. Syst. R&D Center, Toshiba Corp., Yokohama, Japan
fYear
2005
fDate
16-19 Oct. 2005
Firstpage
171
Lastpage
174
Abstract
This paper presents the electrical insulation properties of a newly-developed composite material comprising a nano- and micro-filler mixture. The filler mixture composite was made by dispersing layered silicate fillers and silica fillers in epoxy resin. The filler mixture composite had the same low thermal expansion as aluminum. Moreover, comparison with other composites demonstrated the effects of the filler mixture. The filler mixture composite showed excellent insulation breakdown properties in needle-plate electrode geometry. Microscope observation indicated a densely-packed structure of the filler mixture composite. The morphological feature seems to have an impact on the improvement of insulation breakdown properties.
Keywords
electric breakdown; electric properties; electrodes; epoxy insulation; filled polymers; materials preparation; nanocomposites; thermal expansion; aluminum; densely-packed structure; dispersing layered silicate filler; electrical insulation property; epoxy resin; insulation breakdown; low thermal expansion; microfiller mixture composite; microscope observation; morphological feature; nanofiller mixture composite; needle-plate electrode geometry; Aluminum; Composite materials; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Epoxy resins; Nanocomposites; Nanostructured materials; Silicon compounds; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2005. CEIDP '05. 2005 Annual Report Conference on
Print_ISBN
0-7803-9257-4
Type
conf
DOI
10.1109/CEIDP.2005.1560648
Filename
1560648
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