• DocumentCode
    2811570
  • Title

    Nanodielectric surface performance when submitted to partial discharges in compressed air

  • Author

    Fréchette, M.F. ; Larocque, R.Y. ; Trudeau, M.L. ; Veillette, R. ; Cole, K.C. ; That, M. T Ton

  • Author_Institution
    Inst. de Recherche d´´Hydro, CNRC, Quebec City, Que., Canada
  • fYear
    2005
  • fDate
    16-19 Oct. 2005
  • Firstpage
    727
  • Lastpage
    731
  • Abstract
    Bulk samples of a nanodielectric material were synthesized. This insulating material consisted of a mix of epoxy resin, a SiO2 load and a percent fraction of inorganic nanoparticles. The aim of the present experiment was to determine the performance of the nanodielectric surface when exposed to partial discharges as compared to that of an epoxy containing only the micrometric SiO2 load. A discharge situation featuring a triple-junction condition was used. Low-intensity discharges were produced along a gap formed by the interface between compressed air and the bulk sample. The material containing a small amount of nanoparticles was found to resist much more the present discharge conditions, showing an improved performance as compared to that observed in the case of the epoxy without nanoclay.
  • Keywords
    dielectric materials; materials preparation; nanostructured materials; nanotechnology; organic-inorganic hybrid materials; surface resistance; SiO2; air gap; compressed air; epoxy resin mix; inorganic nanoparticle; insulating material; low-intensity discharge; material synthesis; micrometric load; nanoclay; nanodielectric surface performance; partial discharge; surface resistance; triple-junction condition; Crystalline materials; Dielectric materials; Dielectrics and electrical insulation; Epoxy resins; Nanoparticles; Nanostructured materials; Partial discharges; Silicon compounds; Surface discharges; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2005. CEIDP '05. 2005 Annual Report Conference on
  • Print_ISBN
    0-7803-9257-4
  • Type

    conf

  • DOI
    10.1109/CEIDP.2005.1560786
  • Filename
    1560786