DocumentCode :
2814484
Title :
The effect of grooved surface on dielectric window multipactor
Author :
Chang, C. ; Liu, G.Z. ; Huang, H.J. ; Chen, C.H. ; Zhang, Y.P. ; Liang, T.Z. ; Hou, Q.
Author_Institution :
Dept. of Eng. Phys., Tsinghua Univ., Beijing, China
fYear :
2009
fDate :
28-30 April 2009
Firstpage :
391
Lastpage :
392
Abstract :
Dielectric window breakdown remains a major limiting in transmission of high power microwave (HPM). The effect of surface roughness on multipactor from a periodic rectangular grooved surface under vacuum is investigated by using electromagnetic particle-in-cell (PIC) simulation. The microwave frequency is 2.86 GHz. Vaughan´s secondary emission model [3] is used to calculate the secondary electron yield. Electron cloud space distribution, statistic energy and secondary emission yield et al. are analyzed under periodic grooved surface. It is found that grooved surface with some height and width can significantly reduce the secondary emission yield and suppress multipactor.
Keywords :
computational electromagnetics; electronic engineering computing; microwave switches; Vaughan secondary emission model; dielectric window breakdown; dielectric window multipactor; electromagnetic particle-in-cell simulation; electron cloud space distribution; high power microwave; microwave frequency; periodic grooved surface; periodic rectangular grooved surface; secondary electron yield; secondary emission yield; statistic energy; suppress multipactor; surface roughness; Analytical models; Dielectrics; Electron emission; Flashover; Microwave frequencies; Physics; Power engineering and energy; Rough surfaces; Statistical distributions; Surface roughness; groove surface; high power microwave; suppressing multipactor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Electronics Conference, 2009. IVEC '09. IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3500-5
Electronic_ISBN :
978-1-4244-3501-2
Type :
conf
DOI :
10.1109/IVELEC.2009.5193574
Filename :
5193574
Link To Document :
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