• DocumentCode
    2815664
  • Title

    A study on the microstructural reinforcement of aluminous porcelain insulators with high-strength

  • Author

    Han, Se-Won ; Cho, Han-Goo

  • Author_Institution
    Korea Electrotechnol. Res. Inst., Changwon, South Korea
  • Volume
    3
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    1501
  • Abstract
    The aluminous porcelain insulator with high strength was fabricated. The effects of manufacturing parameters such as sintering temperature, duration time on mechanical strengths were analysed in a view of the microstructural reinforcement. The prime factors which improve the mechanical strength is the fertilization of mullite crystal phase and the reinforcement effect of alumina particles dispersed in matrix phase. The simulation results of stress modeling on the real aluminous porcelain insulator by the NASTRAN program indicate that the maximum compressive stress act on the porcelain part of cap lip, then the compressive strength value on it is about 240 □f/□, which is much lower than the experimental fractural compressive value, 4500 □f/□. The study of reinforcement mechanism with the thermal stress model of microstructure shows the alumina particles with low thermal expansion coefficient compared to matrix materials act as a barrier protecting the progress of microcrack, as a result it governs the improvement of mechanical strength
  • Keywords
    aluminium compounds; compressive strength; crystal microstructure; fracture toughness testing; insulator testing; porcelain insulators; sintering; thermal expansion; thermal stresses; NASTRAN program; alumina particles; aluminous porcelain insulators; cap lip; compressive strength value; dispersed alumina particles; duration time; fractural compressive value; high-strength; low thermal expansion coefficient; manufacturing parameters; matrix phase; maximum compressive stress; mechanical strength; microcrack; microstructural reinforcement; microstructure; mullite crystal phase fertilisation; prime factors; reinforcement effect; reinforcement mechanism; sintering temperature; stress modeling; thermal stress model; Compressive stress; Crystal microstructure; Dispersion; Insulation; Manufacturing; Porcelain; Protection; Temperature; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power System Technology, 2000. Proceedings. PowerCon 2000. International Conference on
  • Conference_Location
    Perth, WA
  • Print_ISBN
    0-7803-6338-8
  • Type

    conf

  • DOI
    10.1109/ICPST.2000.898193
  • Filename
    898193