DocumentCode
281732
Title
Cooling techniques in electronics
Author
Johnson, R.D.
Author_Institution
Redpoint Ltd., Swindon, UK
fYear
1989
fDate
32596
Firstpage
42491
Lastpage
42494
Abstract
There are only three main tools in thermal management: conduction, convection and radiation. The relative importance of each, and the way in which each mechanism is employed varies considerably depending on which level of the electronic system is under consideration. Bearing this in mind, the author discusses the following: passive and active cooling of chips; surface mount assemblies; active cooling of packages and PCBs; and enclosure cooling
Keywords
cooling; integrated circuit technology; packaging; printed circuits; surface mount technology; PCB cooling; active cooling; chip cooling; electronic system; enclosure cooling; packages; passive cooling; surface mount assemblies; thermal management;
fLanguage
English
Publisher
iet
Conference_Titel
Thermal Design of Electronic Systems, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
198143
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