• DocumentCode
    281733
  • Title

    Thermal design of aerospace systems

  • Author

    Landeg, D.R.

  • Author_Institution
    Dynamics Div., BAe plc, Bristol, UK
  • fYear
    1989
  • fDate
    32596
  • Firstpage
    42522
  • Lastpage
    42524
  • Abstract
    As a result of successful efforts to improve electronic circuit performance, the power densities of components have increased significantly. These trends have to be matched by improvements in thermal management and cooling techniques if higher operating temperatures and poorer reliability are to be avoided. The author describes one of the most challenging thermal problems: the cooling of a military system in a hostile natural environment and he emphasises the importance of a multi-disciplinary, analytical approach to the complete system thermal design at an early stage of the project
  • Keywords
    aerospace; cooling; military systems; packaging; aerospace systems; cooling techniques; hostile natural environment; military system; thermal design; thermal management;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Thermal Design of Electronic Systems, IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • Filename
    198144