DocumentCode
281733
Title
Thermal design of aerospace systems
Author
Landeg, D.R.
Author_Institution
Dynamics Div., BAe plc, Bristol, UK
fYear
1989
fDate
32596
Firstpage
42522
Lastpage
42524
Abstract
As a result of successful efforts to improve electronic circuit performance, the power densities of components have increased significantly. These trends have to be matched by improvements in thermal management and cooling techniques if higher operating temperatures and poorer reliability are to be avoided. The author describes one of the most challenging thermal problems: the cooling of a military system in a hostile natural environment and he emphasises the importance of a multi-disciplinary, analytical approach to the complete system thermal design at an early stage of the project
Keywords
aerospace; cooling; military systems; packaging; aerospace systems; cooling techniques; hostile natural environment; military system; thermal design; thermal management;
fLanguage
English
Publisher
iet
Conference_Titel
Thermal Design of Electronic Systems, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
198144
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