DocumentCode
2818210
Title
Comparison of Different Approaches for the Simulation of Topography Evolution during Lithography Development
Author
Schnattinger, T. ; Bär, E.
Author_Institution
Fraunhofer Institute of Integrated Systems and Device Technology (IISB), Schottkystrasse 10,91058 Erlangen, Germany. thomas.schnattinger@iisb.fraunhofer.de
fYear
2005
fDate
01-03 Sept. 2005
Firstpage
215
Lastpage
218
Abstract
Different algorithms for simulating topography evolution are compared in 2D and 3D, using rates for a lithography development process as a bench-marking example. The methods studied are the cell removal, the string, and the fast-marching algorithm. Issues considered are the convergence of the extracted critical dimensions of resist layers with increasing resolution of the simulation grid and the computation time and its dependence on the resolution. Furthermore, it is shown that a slicewise 2D simulation of topography evolution for a 3D structure is not capable of correctly representing the evolving 3D shape of the resist.
Keywords
Chromium; Computational modeling; Convergence; Grid computing; Inhibitors; Lithography; Resists; Spatial resolution; Stability; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2005. SISPAD 2005. International Conference on
Print_ISBN
4-9902762-0-5
Type
conf
DOI
10.1109/SISPAD.2005.201511
Filename
1562063
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