DocumentCode
2818580
Title
The evaluation and comparison of the practical adhesion strength of biocompatible nano and micro thin films by fuzzy logic
Author
Kutilek, Patrik ; Miksovsky, Jan ; Viteckova, Slavka ; Dobesova, Eva
Author_Institution
Fac. of Biomed. Eng., Czech Tech. Univ. in Prague, Kladno, Czech Republic
fYear
2012
fDate
3-4 July 2012
Firstpage
489
Lastpage
493
Abstract
The possibilities of using newly developed nano-and micro-thin films are intensively studied at the present time. Many research institutions are looking for ways to evaluate and compare mechanical properties of these films. One of the most important and frequently studied characteristics is practical adhesion. A very important method for evaluating the practical adhesion strength is scratch test method. However, the research teams usually use a method based on the non-uniform evaluation of adhesion of biocompatible thin films. We designed new evaluation method and procedure based on international standards and fuzzy rule based expert system in order to help to eliminate these problems. This article is aimed at showing the new possibility of using fuzzy logic and established standards for evaluating adhesion of biocompatible thin films in nano and micro dimensions. We used the fuzzy rule based expert system based on international standards to evaluate the often studied DLC biocompatible layers prepared by pulsed laser deposition.
Keywords
adhesion; expert systems; fuzzy set theory; materials testing; mechanical engineering computing; nanostructured materials; standards; thin films; DLC biocompatible layers; adhesion strength; biocompatible nanothin films; film mechanical properties; fuzzy logic; fuzzy rule based expert systems; international standards; microthin films; nonuniform evaluation method; pulsed laser deposition; scratch test method; Adhesives; Coatings; Expert systems; Films; Force; Standards; Testing; Fuzzy logic; international standards; micro-thin film; nano-thin film; practical adhesion; scratch test;
fLanguage
English
Publisher
ieee
Conference_Titel
Telecommunications and Signal Processing (TSP), 2012 35th International Conference on
Conference_Location
Prague
Print_ISBN
978-1-4673-1117-5
Type
conf
DOI
10.1109/TSP.2012.6256342
Filename
6256342
Link To Document