Title :
MEMS packaging technologies & applications
Author :
Chang, Jiyoung ; Lin, Liwei
Author_Institution :
Berkeley Sensor & Actuator Center, Univ. of California at Berkeley, Berkeley, CA, USA
Abstract :
MEMS packaging has become a major manufacturing issue for commercialization. This talk will give a short summary on several MEMS packaging technologies, including an integrated LPCVD nitride bonding process; localized eutectic, fusion and solder bonding processes; RTP (rapid thermal processing) bonding processes; nano-second laser welding process; ultrasonic sealing process; and localized CVD sealing process. The key development in low-temperature solder bonding process will be the focus of the paper by using metals as the MEMS packaging materials to overcome limitations of glass frit bonding. Two bonding methods including the pre-reflow of solder the introduction of thin metal layer are presented.
Keywords :
chemical vapour deposition; laser beam welding; micromechanical devices; rapid thermal processing; reflow soldering; ultrasonic bonding; MEMS packaging; glass frit bonding; integrated LPCVD nitride bonding process; nanosecond laser welding; rapid thermal processing; solder bonding process; ultrasonic sealing; Bonding processes; Commercialization; Inorganic materials; Laser fusion; Manufacturing; Micromechanical devices; Optical materials; Packaging; Rapid thermal processing; Welding;
Conference_Titel :
VLSI Design Automation and Test (VLSI-DAT), 2010 International Symposium on
Conference_Location :
Hsin Chu
Print_ISBN :
978-1-4244-5269-9
Electronic_ISBN :
978-1-4244-5271-2
DOI :
10.1109/VDAT.2010.5496707
