Title :
IEE Colloquium on `Application of Hybrid Power Circuits and Packages´ (Digest No.157)
Abstract :
The following topics were dealt with: customisation; monolithic circuit comparisons; MOSFETs; substrates; application-specific devices
Keywords :
hybrid integrated circuits; packaging; power integrated circuits; MOSFETs; application-specific devices; customisation; monolithic circuit; substrates;
Conference_Titel :
Application of Hybrid Power Circuits and Packages, IEE Colloquium on
Conference_Location :
London
