Title :
A novel modeling approach for multiple coupled wire bond interconnects
Author :
Doerr, Ingo ; Sommer, Grit ; Reichl, Herbert
Author_Institution :
Fraunhofer IZM, Berlin, Germany
Abstract :
A novel approach for electrical modeling of multiple coupled wire bonds up to a frequency of 10GHz is presented. This paper describes a very easy way to get complex electrical model for complex structures like multiple coupled wire bonds. Electromagnetic field computation and compact model extraction using optimization algorithm is limited on few elements. A very efficient way is starting with the development of an equivalent circuit model for a single wire bond. The electrical model of single interconnect is used to model coupled interconnects. Full wave electromagnetic field computation was used to calculate the S-parameters. S-parameters are very good suitable to extract compact models for radio frequencies (RF). Moreover, this procedure is still more effectively by using parameterized models for design kits and libraries.
Keywords :
S-parameters; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; lead bonding; 10 GHz; S-parameters; compact model extraction; complex electrical model; complex structures; coupled interconnects; electrical modeling; electromagnetic field calculation; equivalent circuit model; full wave electromagnetic field computation; multiple coupled wire bond interconnects; multiple coupled wire bonds; parameterized models; radio frequencies; single interconnect; single wire bond; Bonding; Computational modeling; Coupling circuits; Electromagnetic fields; Electromagnetic modeling; Equivalent circuits; Integrated circuit interconnections; Radio frequency; Scattering parameters; Wire;
Conference_Titel :
Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
Print_ISBN :
0-7803-8470-9
DOI :
10.1109/SPI.2004.1409037